Rubik Lead-Based BGA Rework Solder Paste 50g with Tin-Lead Alloy for Mobile Phone Repair, Chip Planting, and Electronic Component Soldering

Name: Rubik Lead-Based BGA Rework Solder Paste 50g with Tin-Lead Alloy for Mobile Phone Repair, Chip Planting, and Electronic Component Soldering
Price: 23.74 USD
Availability: InStock

Product ID: 554205593

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Rubik Lead-Based BGA Rework Solder Paste 50g with Tin-Lead Alloy for Mobile Phone Repair, Chip Planting, and Electronic Component Soldering

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Anjali K.

The product quality is outstanding. Exactly what I needed for my work.

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Fantastic and great service. Shipping was faster than expected.

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TrustScore 4.5 | 7,300+ reviews

Rajesh P.

Customer service was outstanding when I had questions about the product.

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Perfect platform for hard-to-find items. Delivery was prompt.

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