---
product_id: 523319914
title: "Lead-Free Solder Paste, No-Clean High Thermal Conductivity And Conductivity Tin Paste For Cell Phone PCB/IC/BGA/SMD CPU Repairing(SAC305,30G)"
brand: "essmetuin"
price: "$0.58"
currency: USD
in_stock: false
url: https://www.desertcart.us/products/523319914-lead-free-solder-paste-no-clean-high-thermal-conductivity-conductivity
store_origin: US
region: United States of America
---

# High thermal & electrical conductivity 217℃ melting point for high-temp reliability Lead-free, eco-friendly solder paste Lead-Free Solder Paste, No-Clean High Thermal Conductivity And Conductivity Tin Paste For Cell Phone PCB/IC/BGA/SMD CPU Repairing(SAC305,30G)

**Brand:** essmetuin
**Price:** $0.58
**Availability:** ❌ Out of Stock

## Summary

> ⚙️ Elevate your PCB repairs with precision and eco-conscious power!

## Quick Answers

- **What is this?** Lead-Free Solder Paste, No-Clean High Thermal Conductivity And Conductivity Tin Paste For Cell Phone PCB/IC/BGA/SMD CPU Repairing(SAC305,30G) by essmetuin
- **How much does it cost?** $0.58 with free shipping
- **Is it available?** Currently out of stock
- **Where can I buy it?** [www.desertcart.us](https://www.desertcart.us/products/523319914-lead-free-solder-paste-no-clean-high-thermal-conductivity-conductivity)

## Best For

- essmetuin enthusiasts

## Why This Product

- Trusted essmetuin brand quality
- Free international shipping included
- Worldwide delivery with tracking
- 15-day hassle-free returns

## Key Features

- • **Compact & Ready-to-Use:** 30g tube sized for professional repair tasks, easy to handle and store
- • **Precision Flow, Zero Waste:** Pushing-type design ensures smooth, controlled application with no solder wasted
- • **Clean & Safe Post-Soldering:** No-clean flux leaves transparent, non-conductive, non-corrosive residues for hassle-free maintenance
- • **Versatile Application Spectrum:** Perfect for BGA, SMD, IC, CPU repairs across phones, TVs, motors, and industrial electronics
- • **Industry-Grade Alloy Composition:** Premium SAC305 formula with 96.5% tin, 3% silver, and 0.5% copper for superior joint strength

## Overview

ZHUOBAO's SAC305 Lead-Free Solder Paste offers a high-performance, no-clean solution with a melting point of 217℃, combining superior thermal and electrical conductivity. Its pushing-type design minimizes waste, while the premium alloy composition ensures durable, reliable joints for professional-grade repairs on cell phones, ICs, BGAs, and more—all with environmentally responsible, non-corrosive residues.

## Description

Hello,My Friend, Have A Nice Day. It's A Great Honor For You To Visit Our Essmetuin Shop. Thank you For Reading Our Brand Stories.
Our Team Has Been Engaged In Soldering And Related Products For Many Years, And Also Has Its Own Factory In China, Strictly Controlling Product Quality,
Spared No Effort To Bring High-Quality And Inexpensive Goods To You.
Customers Life our God, And It Is Our Unshirkable Responsibility And Obligation To Serve You.

## Features

- Essmetuin SAC305 Solder Paste Content: Alloy Tin 96.5%Ag3%Cu0.5%, Solder Flux Content: 10.8%
- Lead-Free Solder Paste -High-Temperature Solder Paste With Flux, Melting Point: 217 ℃ (422.6.4F)
- Product Advantages: Pushing-Type Design Smoother Flowing No Wasting During Welding
- Widely Used In BGA /SMD Circuit Board,Motors, Lighting, IC, TV and Other Household Appliances And Industrial Equipment, Sensors, Wires, Fuses, Phone, Metal Shells, Motors, Lighting, Connectors, SMT Maintenance
- High thermal conductivity and conductivity.The Post Soldering Transparent Residues Are Non-Conductive, Non-Corrosive And Highly Insulated

## Technical Specifications

| Specification | Value |
|---------------|-------|
| Asin | B0BW7M7F4H |
| Best Sellers Rank | #440,341 in Industrial & Scientific (See Top 100 in Industrial & Scientific) #867 in Solder |
| Customer Reviews | 4.0 4.0 out of 5 stars (47) 4.0 out of 5 stars |
| Date First Available | February 19, 2023 |
| Included Components | SAC305 Solder Paste |
| Item Model Number | SAC305 |
| Item Weight | 1.44 ounces |
| Manufacturer | ZHUOBAO |
| Material | lead |
| Power Source | fuel_powered |
| Product Dimensions | 1.32 x 0.92 x 3.72 inches |
| Size | Sn96.5Ag3.0Cu0.5 |

## Images

![Lead-Free Solder Paste, No-Clean High Thermal Conductivity And Conductivity Tin Paste For Cell Phone PCB/IC/BGA/SMD CPU Repairing(SAC305,30G) - Image 1](https://m.media-amazon.com/images/I/7165fv81v6L.jpg)
![Lead-Free Solder Paste, No-Clean High Thermal Conductivity And Conductivity Tin Paste For Cell Phone PCB/IC/BGA/SMD CPU Repairing(SAC305,30G) - Image 2](https://m.media-amazon.com/images/I/71UPHICW5sL.jpg)
![Lead-Free Solder Paste, No-Clean High Thermal Conductivity And Conductivity Tin Paste For Cell Phone PCB/IC/BGA/SMD CPU Repairing(SAC305,30G) - Image 3](https://m.media-amazon.com/images/I/717LOsQp0cL.jpg)
![Lead-Free Solder Paste, No-Clean High Thermal Conductivity And Conductivity Tin Paste For Cell Phone PCB/IC/BGA/SMD CPU Repairing(SAC305,30G) - Image 4](https://m.media-amazon.com/images/I/814kGncK7HL.jpg)
![Lead-Free Solder Paste, No-Clean High Thermal Conductivity And Conductivity Tin Paste For Cell Phone PCB/IC/BGA/SMD CPU Repairing(SAC305,30G) - Image 5](https://m.media-amazon.com/images/I/71bSwgImtaL.jpg)

## Available Options

This product comes in different **Size** options.

## Frequently Bought Together

- Lead-Free Solder Paste, No-Clean High Thermal Conductivity And Conductivity Tin Paste For Cell Phone PCB/IC/BGA/SMD CPU Repairing(SAC305,30G)
- MG Chemicals 8341-50ML No-Clean Soldering Flux Paste, 49.0 g Jar, Pack of 1
- Solder Paste Glue Dispenser for 10cc Solder Paste Flux, Extruder for Syringe Solder Paste, (Single Glue Dispenser, Solder Flux Excluded)

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*Product available on Desertcart United States of America*
*Store origin: US*
*Last updated: 2026-10-18*